Tag: University of Illinois Urbana-Champaign

May 26, 2022

New method for dissipating heat in electronic devices

A research team from the University of Illinois Urbana-Champaign (UIUC) and University of California (UC) Berkeley has published a paper that explores a new cooling method for electronic devices. Electronic devices often generate high temperates, and these need to be cooled to prevent the device being compromised or damaged. Traditionally, exisiting cooling methods can have […]